Copper is a key material in semiconductor manufacturing, where it is used for interconnects and wiring layers because of its high electrical conductivity and reliability in integrated circuits [1]. In TFT displays and electronic backplanes, copper thin films are used as conductive layers to enable fast signal transmission and improved device performance [2]. Copper is also widely used in battery materials, serving as a current collector in lithium-ion batteries due to its stability and low electrical resistance [3]. High-purity copper is supplied in forms suitable for evaporation and physical vapor deposition, supporting thin-film fabrication for electronics, coatings, and advanced manufacturing applications, including 3D printing feedstocks and backing plate materials.
Additional Documents
References
Nitta, N.; Wu, F.; Lee, J. T.; Yushin, G.
“Li-ion battery materials: Present and future,”
Materials Today, 18 (2015) 252–264. pdf
| Product ID | Description | Compare | expand | |
| TPCU3D3T0004N | Pellets | 3 mm dia x 3 mm th. | 99.99% | |||
| TPCU6D6T0005N | Pellets | 6 mm dia x 6 mm th. | 99.999% | |||
| TPCU3D3T0005N | Pellets | 3 mm dia x 3 mm th. | 99.999% |
| Product ID | Description | Compare | expand | |
| BPCU2D0T004N8 | Backing Plate | 2 inch dia x 0.125 inch th. | OFHC Plate, RD~99% | 99.998% | |||
| BPCU3D0T004N8 | Backing Plate | 3 inch dia x 0.125 inch th. | Backing plate, RD~99% | 99.998% | |||
| BPCU3D0T004N8-1 | Backing Plate | 3 inch dia x 0.25 inch th. | 99.998% | |||
| BPCU2D1T004N8 | Backing Plate | 2 inch dia x 1 mm th. | HFHC plate, RD~99% | 99.998% | |||
| BPCU2D2T004N8 | Backing Plate | 2 inch dia x 2 mm th. | OFHC Plate, RD~99% | 99.998% | |||
| Product ID | Description | Compare | expand | |
| SPCU2D6T0004N | Sputtering Target | 2 inch dia x 0.25 inch th. | 99.99% | |||
| SPCU3D1T004N8 | Sputtering Target | 3 inch dia x 1.6 mm th. | Backing plate | 99.998% | |||
| SPCU3D3T0004N | Sputtering Target | 3 inch dia x 0.125 inch th. | 99.99% | |||
| SPCU3D6T0004N | Sputtering Target | 3 inch dia x 0.25 inch th. | 99.99% | |||
| SPCU4D3T0004N | Sputtering Target | 4 inch dia x 0.125 inch th. | 99.99% | |||
| Product ID | Description | Compare | expand | |
| POCU62500003N-1 | Powder | -625 mesh approx | Spherical | 99.9% | |||
| POCU3250003N5 | Powder | -325 mesh (20 mic aps) | 99.95% | |||
| POCU1000002N7 | Powder | -100 +200 mesh | D10=81.98, D50=103.7, D90=119.8 | Flakes | 99.7% | |||
| POCU20000003N | Powder | 200 nm approx | Nano, spherical | 99.9% | |||
| POCU4800002N5 | Powder | -4800 mesh (2 mic aps) approx | 99.5% | |||
| Product ID | Description | Compare | expand | |
| GRCU36000004N | Granules | 3 mm -6 mm | 99.99% |
| Product ID | Description | Compare | expand | |
| BECU62500004N | Beads | 6 -25 mm | 99.9% |
| Product ID | Description | Compare | expand | |
| FOCU3100004N8 | Foil | 3 inch dia x 1 mm | Backing plate | 99.998% | |||
| FOCU10100005N | Foil | 10 mm dia x 1 mm | 99.999% | |||
| FOCU50100005N | Foil | 50 mm dia x 1 mm | 99.999% | |||
| FOCU57000005N | Foil | 57 mm dia x 0.5 mm | 99.999% | |||
| FOCU10005014N8 | Foil | 1000 mm x 50 mm x 1 mm | 99.998% | |||
| Product ID | Description | Compare | expand | |
| SHCU2600006N3 | Shots | 2 -6 mm | 99.99993% | |||
| SHCU50000004N | Shots | 5 mm approx. | 99.99% |
| Product ID | Description | Compare | expand | |
| WRCU22000004N | Wire | 2 mm dia. x 2 mm length | 99.99% |
| Product ID | Description | Compare | expand | |
| DKCU9000005N5 | Disk | 9 mm dia. x 0.8 mm th. | 99.9995% |
| Product ID | Description | Compare | expand | |
| STCU30000004N | Sheets | 300 mm dia. x 0.001 cm th. | Continuous length roll | 99.99% |
| Product ID | Description | Compare | expand | |
| GPCU0000000N0 | Pieces | < 0 mm 0 |
