Copper, Backing Plate, 99.998%, 3 inch dia x 0.125 inch th.

High-purity copper sputtering targets are used to deposit conductive thin films and interconnects in integrated circuits and electronic components.

Copper is a primary alloying element used to enhance the mechanical properties, corrosion resistance, and conductivity of various non-ferrous metal systems.

Spherical copper powders are utilized in additive manufacturing processes like Selective Laser Melting (SLM) to produce complex thermal management components.

Copper pellets and wire are used as source materials in physical vapor deposition to create high-conductivity metallic layers on substrates.

Copper is used in semiconductor fabrication for metallization layers and through-silicon vias (TSVs) due to its superior electromigration resistance and low resistivity.

Copper nanoparticles are researched and applied in conductive inks, catalysts, and antimicrobial coatings due to their high surface-area-to-volume ratio.