Molybdenum, Backing Plate, 99.9%, 14.03 inch dia x 0.75 inch th.

Molybdenum sputtering targets are used to deposit thin films for thin-film transistor (TFT) liquid crystal displays and solar cell electrodes due to high conductivity and excellent adhesion.

Molybdenum is a critical alloying element in stainless steels and superalloys to enhance strength, hardenability, and resistance to corrosion and creep at high temperatures.

As a refractory metal, molybdenum is used in high-temperature furnace components, structural parts, and glass melting electrodes where resistance to extreme heat is required.

Molybdenum is utilized as an evaporation material in physical vapor deposition processes to create conductive layers and barrier coatings in microelectronics.

Molybdenum powders are applied via thermal spray techniques to provide wear-resistant and low-friction coatings on automotive components like piston rings and synchromesh rings.

Spherical molybdenum powders are used in additive manufacturing processes like Laser Powder Bed Fusion (LPBF) to produce complex, high-density refractory components.