Refractory Metals and Compounds

At LTS Research Laboratories, Inc., we specialize in supplying high purity refractory metals and compounds for advanced thin film deposition processes. These materials are ideal for demanding environments where thermal stability, chemical resistance, and mechanical durability are critical. Our product line supports both research and production-scale applications in microelectronics, aerospace, optoelectronics, and semiconductor fabrication. Refractory materials are known for their high melting points, typically above 2000°C, and their stable performance in vacuum and high-temperature deposition systems. We offer these materials in multiple formats optimized for physical vapor deposition (PVD), including sputtering targets, evaporation pellets, and pre-melted slugs for e-beam systems. Our selection includes: Pure metals such as tantalum (Ta), molybdenum (Mo), tungsten (W), niobium (Nb), and hafnium (Hf) Carbides and nitrides including TiC, ZrC, TaC, and TiN Oxides and borides engineered for functional and protective coatings These materials are commonly used to produce barrier layers, electrodes, diffusion-resistant coatings, reflective and IR coatings, and hard, wear-resistant films. Their high melting points and low vapor pressures make them well suited for high energy deposition environments, while their purity ensures strong adhesion, dense film growth, and excellent electrical or optical performance, depending on the application. All materials are refined to 99.9% purity or higher and manufactured to meet the tight specifications required for thin film device manufacturing. Whether you are working in ion beam sputtering, magnetron sputtering, or e-beam evaporation, LTS delivers the materials that ensure coating integrity and process consistency.