Aluminum Copper Alloy, Foil, 99.999%, 200 mm dia x 1 mm

Aluminum-copper alloy sputtering targets are used to deposit thin-film interconnects in integrated circuits to improve electromigration resistance compared to pure aluminum.

Copper is added to aluminum as a primary alloying element to significantly increase strength and hardness through precipitation hardening, creating high-strength aerospace and structural materials.

Gas-atomized Al-Cu alloy powders are utilized in selective laser melting (SLM) and other additive manufacturing processes to produce lightweight, high-strength functional components.

Used in the metallization phase of semiconductor fabrication to create conductive paths and bond pads that are resistant to thermal and electrical stress.