Molybdenum Silicide, Powder, 99.5%, -80 +200 mesh (127 mic aps)

Molybdenum silicide is used as a sputtering target material to deposit thin films that serve as oxidation-resistant coatings and conductive interconnects in microelectronics.

MoSi2 is utilized as a high-grade refractory material for heating elements due to its ability to form a protective silica layer at high temperatures.

It is employed in high-temperature structural components and furnace elements that operate in oxidizing atmospheres up to 1700°C.

Used in the semiconductor industry for the formation of ohmic contacts and gate electrodes due to its high thermal stability and low resistivity.