Tin Silver, Powder, 99.9%, -300 micron approx

Tin Silver alloys are used as sputtering targets to create thin-film coatings for lead-free solder bumps and interconnects in microelectronic packaging.

Used as a primary lead-free solder alloy (SAC or Sn-Ag binary) to provide mechanical strength and thermal fatigue resistance in electronic assemblies.

Utilized in physical vapor deposition processes to deposit conductive layers and bonding interfaces for semiconductor device fabrication.