Chemical Name
Tin Silver
Chemical Formula
SnAg
Purity
99.9%
Composition
96.5/3.5 wt% Sn:Ag
Size
-300 micron approx
EINECS Number
Quantity Available
kg
CAS Number
Status
15 kg
Product ID
POSNAG300003N
Hazmat
Catalog Number
12067
Description
Atomized
Comments
Tin Silver alloys are used as sputtering targets to create thin-film coatings for lead-free solder bumps and interconnects in microelectronic packaging.
Used as a primary lead-free solder alloy (SAC or Sn-Ag binary) to provide mechanical strength and thermal fatigue resistance in electronic assemblies.
Utilized in physical vapor deposition processes to deposit conductive layers and bonding interfaces for semiconductor device fabrication.
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