Ruthenium, Rod, 99.95%, 10 mm dia x 13 mm length

Ruthenium sputtering targets are used to create thin films for perpendicular magnetic recording (PMR) in hard disk drives and as seed layers or diffusion barriers in advanced semiconductor interconnects.

Ruthenium is added to platinum and palladium alloys to increase hardness and to titanium to significantly improve corrosion resistance in acidic environments.

Used as a high-work-function metal for gate electrodes and as a liner material for copper interconnects in sub-10nm logic nodes.

High-purity ruthenium pellets are used as evaporation sources for the deposition of thin metallic films in microelectronic and optical applications.