Chemical Name
Tin Silver Copper Alloy
Chemical Formula
SnAgCu
Purity
99.99%
Composition
96.5/3/0.5 wt% Sn:Ag:Cu
Size
3 inch dia x 0.250 inch th.
EINECS Number
Quantity Available
pcs
CAS Number
Status
Product ID
SPSNAGCU3D6T4N
Hazmat
Powder: Class 4.1, UN3089, PG III
Catalog Number
13485
Description
Comments
Tin Silver Copper (SAC) alloy targets are used in physical vapor deposition to create lead-free conductive thin films and solderable layers in microelectronic packaging.
SAC alloys serve as the primary lead-free solder material for ball grid arrays (BGA) and flip-chip interconnects in semiconductor device assembly.
Atomized SAC alloy powders are utilized in specialized additive manufacturing processes for printing complex conductive geometries and electronic components.
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