Tantalum
Sputtering TargetEINECS Number
231-135-5
Quantity Available
pcs
CAS Number
7440-25-7
Status
Product ID
SPTA4D6T003N5
Hazmat
Powder: Class 4.1, UN3089, PG II
Catalog Number
1036
Description
Comments
RD~99%
Tantalum sputtering targets are used to create thin films for semiconductor barriers and high-performance capacitors.
Tantalum is used as an alloying element in superalloys for jet engine components to improve strength and corrosion resistance at high temperatures.
Due to its high melting point and chemical inertness, tantalum is utilized in the production of laboratory equipment and chemical reaction vessels.
Spherical tantalum powder is used in additive manufacturing to produce biocompatible medical implants and high-density aerospace components.
Tantalum is used in physical vapor deposition processes as a source material for coating optical and electronic components.
Tantalum and tantalum nitride serve as essential diffusion barriers between copper interconnects and silicon substrates in integrated circuits.
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