Tantalum
Sputtering TargetChemical Name
Chemical Formula
Purity
99.995%
Composition
Nb<30 ppm
Size
8 inch dia x 0.25 inch th.
EINECS Number
231-135-5
Quantity Available
pcs
CAS Number
7440-25-7
Status
Product ID
SPTA8D6T004N5-1
Hazmat
Powder: Class 4.1, UN3089, PG II
Catalog Number
4118
Description
Comments
RD~99%, high purity, low Nb
Tantalum sputtering targets are used to create thin films for semiconductor barriers and high-performance capacitors.
Tantalum is used as an alloying element in superalloys for jet engine components to improve strength and corrosion resistance at high temperatures.
Due to its high melting point and chemical inertness, tantalum is utilized in the production of laboratory equipment and chemical reaction vessels.
Spherical tantalum powder is used in additive manufacturing to produce biocompatible medical implants and high-density aerospace components.
Tantalum is used in physical vapor deposition processes as a source material for coating optical and electronic components.
Tantalum and tantalum nitride serve as essential diffusion barriers between copper interconnects and silicon substrates in integrated circuits.
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