Tantalum Silicide
Sputtering TargetChemical Name
Chemical Formula
Purity
99.9%
Composition
Size
13 inch dia x 0.350 inch th.
EINECS Number
234-902-2
Quantity Available
pcs
CAS Number
12039-79-1
Status
Product ID
SPTASI213D0T3N
Hazmat
Catalog Number
4680
Description
Comments
Microelectronics grade
Used as a conductive material for gates and interconnects in integrated circuits due to its high temperature stability and low resistivity.
Fabricated into sputtering targets for the deposition of thin films used in microelectronics and protective coatings.
Utilized in high-temperature environments due to its excellent oxidation resistance and high melting point.
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