Tungsten, Sputtering Target, 99.98%, MRC (4.75 inch x 14.875 inch x 0.250 inch th.)

Tungsten sputtering targets are used to deposit thin films for diffusion barriers and interconnects in integrated circuits.

Tungsten is a critical alloying element in high-speed steels and superalloys to enhance hardness and high-temperature strength.

As a refractory metal, tungsten is utilized in high-temperature furnace components and crucibles due to its exceptionally high melting point.

Tungsten is used as an evaporation material or as a filament/boat source for the thermal evaporation of other metals and compounds.

Spherical tungsten powder is employed in additive manufacturing processes like Selective Laser Melting (SLM) for producing dense, radiation-shielding components.

Tungsten and tungsten carbide powders are used in thermal spray coating processes to provide superior wear and erosion resistance to industrial parts.