Tungsten Silicide
Sputtering TargetChemical Name
Chemical Formula
Purity
99.5%
Composition
Size
MRC (4.75 inch x 14.875 inch x 0.250 inch th.)
EINECS Number
234-909-0
Quantity Available
pcs
CAS Number
12039-88-2
Status
Product ID
SPWSI2MRC02N5
Hazmat
Catalog Number
6087
Description
Comments
Used as a contact material and in polycide gates within integrated circuits due to its high conductivity and thermal stability.
Fabricated into sputtering targets for the deposition of thin-film silicide layers in microelectronic device manufacturing.
Utilized for its high melting point and oxidation resistance in high-temperature coating applications.
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