Lead, Wire L, 99.9%, 1.00 mm dia. x 250 meter length

Lead sputtering targets are used to deposit thin films for superconducting applications, radiation shielding layers, and as a component in ferroelectric thin-film deposition.

High-purity lead is used as an evaporation material in physical vapor deposition processes to create protective coatings and specific electronic components.

Lead is widely used as an alloying element to improve the machinability of steels and copper alloys, and is a primary component in various solder and bearing metal alloys.