Aluminum, Wafer, 99.999%, 106 mm dia x 2.5 mm th.

High-purity aluminum sputtering targets are used to deposit thin-film conductive interconnects and contact layers in integrated circuits and microelectronic devices.

Aluminum pellets and wire are widely used as evaporation sources in physical vapor deposition (PVD) to create reflective coatings on mirrors and decorative metallic finishes.

Aluminum is a primary alloying element used to improve the strength-to-weight ratio and corrosion resistance of various metal systems, particularly in aerospace and automotive applications.

Spherical aluminum powders are utilized in selective laser melting (SLM) and direct metal laser sintering (DMLS) to produce lightweight, complex structural components.

Aluminum is deposited via vacuum processes to create highly reflective optical coatings for telescopes, lasers, and laboratory instrumentation across the UV and visible spectrum.

Aluminum foil serves as the essential current collector for the cathode side of lithium-ion batteries due to its electrochemical stability at high potentials.

Aluminum and aluminum-alloy powders are used in thermal spray processes to provide sacrificial cathodic protection and atmospheric corrosion resistance to steel structures.