Silicon Dioxide, Sputtering Target, 99.999%, 150 mm dia x 8 mm th.

Silicon dioxide is used as a high-purity sputtering target to deposit thin-film dielectric layers and insulating barriers in microelectronic and optical devices.

Used as a low-refractive index material in multilayer interference filters, anti-reflective coatings, and high-reflectivity mirrors.

Serves as a fundamental passivation layer, gate dielectric, and interlayer dielectric for electrical isolation in integrated circuit fabrication.

Commonly evaporated via electron beam or thermal methods to create protective and functional thin films on various substrates.

Produced as fumed silica or silica nanoparticles for use as fillers, reinforcement agents, and in drug delivery systems.